IES offers a full range of services to meet your aftermarket manufacturing needs. Our services eliminate the need for you to spend time or money on designing a replacement part or committing resources to a complete product redesign. We’ll rework, repair, refurbish, and modify your electronic products for you. We use modern equipment and IPC-certified operators to ensure our work is done correctly and quickly. Our rework service provides analysis and repair of ball grid array (BGA), electronic components, embedded firmware, and printed circuit boards (PCB); we re-test to ensure they return to original functionality.
Our internal or cosmetic refurbish service includes adding or replacing circuits and swapping mechanical components and outer casings. And, our modification service provides comprehensive board-level enhancements, including circuit modification of outer and inner layers, drill, etch, fill, and redrill of tooling holes. We also offer end-to-end engineering services to complement your in-house design team, delivering timely, cost-conscious solutions to match your unique specifications. We provide flawless quality assurance (QA), including testing via our proprietary custom-designed test equipment.
Our failure analysis (FA) services pinpoint and correct root causes of electrical defects by simulating real-world operating conditions for our PCBA and OEM product builds. We use a built-in bed-of-nails fixture for standalone PCBs, as well as an additional custom-designed flexible probe apparatus for checking boards following conformal coating protection and unit installation. Our test equipment can be configured to simulate anticipated operating conditions in the field, ensuring optimal product performance, even under the most extreme parameters, and applies standard QA tests, such as in-line ICT/MDA checks and optical/x-ray inspections.
Our certified technicians are experienced in analyzing both mainstream assembly methods, such as surface mount and through-hole, as well as specialized processes, which include BGA reballing and leadless chip carrier rework. Our technicians are IPC 7711/7721 certified and highly experienced in custom design solutions for both mainstream assembly methods (surface mount and through-hole), as well as specialized processes, which include BGA rework and reballing, leadless chip carrier rework, PCB repair, CCA rework, and jumper wire/white wire services.
•ANSI IPC-R-700C Specifications
•24-Hour Turn Emergency Replacements and Exchanges
•Product Repair Tracking
On-site 3D Printing Available for this Service