Lead-free solder capabilities

We can provide you with a machine built prototype circuit board or run thousands.  IES, Inc. SMT capabilities and commitment to continuous improvement put us a step above other electronic manufacturers. During the last several years we have seen component density become tighter, the changing of circuit board thickness, and more fine pitch devices. With the wide diversity of components and circuit board assemblies being used in the industry today, IES, Inc. remains on the leading edge of technology.

We can accommodate low or high volume manufacturing associated with a first class quality product. Our staff is committed to serve your needs through our innovative processes and continued pursuit of excellence.

All of our SMT modules are equipped with Dek 265 Screen Printers and BTU VIP98 Forced Convection Reflow Ovens. The ovens have seven zones with top and bottom-side heating and thermal stability within +/-1 degree C. The SMT modules are capable of top and bottom-side reflow. We process No-Clean, Water Soluble, and Leadless Solder Paste in our manufacturing processes.