Surface Mount Technology

IES now has three state of the art SMT lines including two new Universal and a Panasonic line.

With our state-of-the-art SMT modules and our thoroughly trained SMT Technicians, IES can provide you with a machine built prototype circuit board or run thousands. Often we are able to make shipments on the same day!

Surface Mount TechnologyLead-free solder capabilities

IES’s SMT capabilities and commitment to continuous improvement put us a step above other electronic manufacturers. During the last several years we have seen component density become tighter, the changing of circuit board thickness, and more fine pitch devices. With the wide diversity of components and circuit board assemblies being used in the industry today, IES remains on the leading edge of technology.

We can accommodate low or high volume manufacturing associated with a first class quality product. Our staff is committed to serve your needs through our innovative processes and continued pursuit of excellence.

All of our SMT modules are equipped with Dek Screen Printers and BTU Forced Convection Reflow Ovens. The ovens have controlled zones with top and bottom-side heating and thermal stability within +/-1 degree C. The SMT modules are capable of top and bottom-side reflow. We process No-Clean, Water Soluble, and both Leaded and Lead-Free Solder Paste in our manufacturing processes.

  Panasonic SMT Capabilities Universal SMT Capabilities
PCB Size 2"x2" to 22"x18"
Multiple array panel sizes
2"x2" to 20"x16"
Multiple array panel sizes
Thickness .020" to .20" .020" to .20"
Component Range 402 to 55mm QFP,
Micro BGA, Flip Chips down to
.5mm spacing, connectors.
201 to 55mm QFP,
Micro BGA, Flip Chips down to
.5mm spacing, connectors.
Feeder Capability Tape ( 8mm to 56mm)
Stick/ Tube tray/ Stationary
& Random Access.
Tape ( 8mm to 56mm)
Stick/ Tube tray/ Stationary
& Random Access.
Placement Rate 40,000 per hour 36,000 per hour