Capabilities

Capabilities – SMT Technology

  • PCB Size: 2”x 2” to 20”x 16”, multiple array panel sizes
  • Thickness: 0.020” to 0.20”
  • Component Range: 0201 to 65mm square, Micro BGA, Flip chips down to .4mm spacing,
  • Feeder Capability: Tape (8mm to 65mm) Stick/ Tube tray/ Stationary & Random Access
  • Screen Printers
  • BTU forced convection ovens: thermal stability within +/- 1 degree Celsius

Capabilities – Ball Grid Array (BGA)

  • 14 years of experience in placement and processing
  • 11 years of experience with micro BGA devices
  • Processing flip chip BGA’s down to .5mm pitch
  • Localize placement of BGA devices without usage of a SMT Manufacturing Line.
  • Extensive experience with localized rework of BGA’s
  • In-house X-ray to verify BGA reflow and rework processes

Capabilities – PCB

  • FR4
  • Rogers
  • Metal Core
  • Rigid-Flex
  • Flex

Capabilities – Through - Hole

  • Process Control Technologies
  • Slide Line with center takeaway
  • Wave solder
  • Water wash
  • Ultrasonic Cleaner

Capabilities – Box Build & Final Assembly

  • 12 years experience
  • Customized Assembly Lines
  • Wire prep and cutting equipment
  • Wire harness

Capabilities – TEST

  • AOI
  • X-Ray
  • Board Level
  • Part Programming
  • Functional
  • System

Capabilities – Quality

  • ISO 9001:2008
  • IPC-A-610 Class III
  • J-STD-001
  • SPC System
  • FAI Report Generation
  • Lot Tracking

IES Capabilities