IES,
Inc. is a leader in processing Ball
Grid Array devices
Over the past 7 years we have seen
these packages become smaller & the ball pitch tighter. IES, Inc.
can provide a comprehensive process development for any device that
you may choose.
What sets IES, Inc. apart
from the competition:
- More than 7 years of experience
in placement and processing.
- 5 years of experience with micro
BGA devices.
- Processing flip chip BGA's down
to .5mm pitch.
- Ability to place BGA devices and
perform hand assembly of prototypes without the cost of solder
stencils, programming and setup fees.
- Extensive experience with
localized rework of BGA's utilizing our Pace TF2000 Rework
Stations.
- In-house Nicolet 1510 X-ray to
verify BGA reflow and rework processes.
- Advanced Image Processing
software on our X-ray system to further verify ball collapse,
presence of voiding and profile construction of solder deposits.
Ball Grid Array Rework
The Nicolet Imaging System
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The Nicolet Imaging System
X-Ray offers additional quality control over the Surface Mount
Manufacturing and the BGA Rework/Replacement process. |
TF2000
TF2000 Capabilities include:
Placing a wide variety of component types and sizes: PBGAs, UBGAs,
CSPs, Flip Chips or any SMD; effectively pre-heating multi-layer and
large circuit boards; documenting quality assurance and process
control. The TF2000 delivers unparalleled programmability and
process control to ensure accurate placement and installation.
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